highestlayer

maxpin

maxjunction

mintrackwidth

mintrackgap

minhole

minBGApingap

maxpin

High-speedsignal

40

80000+

50000+

2mil(HDI)

2mil(HDI)

6mil(4milforlaserdrill)

0.33mm

2500

2500

Capability

highestlayer

maxsize

mintrack/gap

maxcopperthickness

mintrackgap

maxaspectratio

minBGApitch

minhole

minBGApad

40

889*609mm

2.5/2.5mil

6OZ

2mil(HDI)

20:01

0.4mm

6mil(4milforlaserdirll)

8mil

LeadTime

2-8L

10-18L

20-40L

3-7days

6-14days

10-20ays

Weldingpoint

SMTline

solderingtype

minpackage

minaccuracy

PCBsize

PCBthickness

2,000,000+/days

2

ReflowSoldering/WaveSoldering

03015Chip/0.35PitchBGA

±0.04mm

50*50mm---686*508mm

0.3---6.5mm