Design capability:
highestlayer |
maxpin |
maxjunction |
mintrackwidth |
mintrackgap |
minhole |
minBGApingap |
maxpin |
High-speedsignal |
40 |
80000+ |
50000+ |
2mil(HDI) |
2mil(HDI) |
6mil(4milforlaserdrill) |
0.33mm |
2500 |
2500 |
PCB Fabrication:
Capability |
highestlayer |
maxsize |
mintrack/gap |
maxcopperthickness |
mintrackgap |
maxaspectratio |
minBGApitch |
minhole |
minBGApad |
40 |
889*609mm |
2.5/2.5mil |
6OZ |
2mil(HDI) |
20:01 |
0.4mm |
6mil(4milforlaserdirll) |
8mil |
LeadTime |
2-8L |
10-18L |
20-40L |
3-7days |
6-14days |
10-20ays |
PCBA Capability:
Weldingpoint |
SMTline |
solderingtype |
minpackage |
minaccuracy |
PCBsize |
PCBthickness |
2,000,000+/days |
2 |
ReflowSoldering/WaveSoldering |
03015Chip/0.35PitchBGA |
±0.04mm |
50*50mm---686*508mm |
0.3---6.5mm |